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  <title>業界初の D1β DRAM と 232L QLC 3D NAND をチェックしてみましょう</title>
  <link>https://www.techinsights.com/ja/discover-inaugural-analysis-reports-d1b-dram-and-232l-qlc-3d-nand</link>
  <description>&lt;span class="field field--name-title field--type-string field--label-hidden"&gt;查看首款 D1β DRAM 和232L QLC 3D NAND相关的更多内容&lt;/span&gt;
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&lt;span class="field field--name-created field--type-created field--label-hidden"&gt;&lt;time datetime="2023-11-27T15:01:29+00:00" title="Monday, November 27, 2023 - 15:01" class="datetime"&gt;Mon, 11/27/2023 - 15:01&lt;/time&gt;
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      &lt;h1 class="bold"&gt;&lt;b&gt;查看首款 D1β DRAM 和232L QLC 3D NAND相关的更多内容&lt;/b&gt;&lt;/h1&gt;
      &lt;h4 class="bold pt-1"&gt;让我们来看看IC市场动态、TechInsights逆向工程团队正在分析哪些器件？&lt;/h4&gt;
      &lt;p class="pt-1"&gt;以及未来器件技术路线图。&lt;/p&gt;
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      &lt;h3 class="white center bold"&gt;突破性事件: 从苹果iPhone 15 Pro中发现的行业首款 D1β LPDDR5X DRAM&lt;/h3&gt;
      &lt;p class="white center"&gt;在不使用EUV光刻技术的情况下成功完成集成13nm DRAM单元设计。 美光的D1β DRAM工艺采用高钾金属栅极(HKMG)。 存储密度比之前的LPDDR5/5X D1α 16Gb芯片提高了42%。 较小的芯片尺寸 (密封边缘)36.78 mm&lt;sup&gt;2&lt;/sup&gt; (7.02 mm x 5.24 mm)，密度为0.435 Gb/mm&lt;sup&gt;2&lt;/sup&gt;。&lt;/p&gt;
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      &lt;h2 class="bold left"&gt;当前的IC市场和展望&lt;/h2&gt;
      &lt;ul&gt;
        &lt;li&gt;预计2023年电子OEM销量将下降3%，IC销量将下降13%。&lt;/li&gt;
        &lt;li&gt;IC市场的下行受存储行业影响；疫情期间的需求导致存储产品库存过剩。&lt;/li&gt;
        &lt;li&gt;从连续13周的移动平均销量来看，NAND下降了22%，DRAM下降了30%。&lt;/li&gt;
        &lt;li&gt;在13周期间，逻辑器件的移动平均销量转为正数，而模拟器件和功率器件销量继续下滑。汽车IC的增长正在放缓。&lt;/li&gt;
        &lt;li&gt;最近的人工智能热潮表明，对能够容纳人工智能的技术有巨大的需求，例如强大的GPU和HBM。&lt;/li&gt;
        &lt;li&gt;存储器件价格已经开始上涨，这是一个强有力的指标，表明整个供应链的供应持续减少，复苏正在进行中。&lt;/li&gt;
        &lt;li&gt;存储器件投资预计将在2023年减少27%，随后在2024年增加10%，推动复苏。&lt;/li&gt;
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      &lt;h2 class="bold left"&gt;分析中的半导体器件&lt;/h2&gt;
      &lt;p&gt;TechInsights在创新产品推出后获得这些产品，并会从先进半导体的制造工艺、材料、设计技术和电气特性等方面对它们进行分析。 查看TechInsights已发布半导体器件分析，如果您对分析报告感兴趣，请联系我们。&lt;/p&gt;
      &lt;ul&gt;
        &lt;li&gt;TSMC - 3nm FinFET&lt;/li&gt;
        &lt;li&gt;Micron - D1β DRAM, 232L NAND&lt;/li&gt;
        &lt;li&gt;Samsung - 3nm GAA, D1a DRAM, HBM2E&lt;/li&gt;
        &lt;li&gt;SK hynix &amp;amp; Solidigm - D1a DRAM, D1y GDDR6, 192L NAND&lt;/li&gt;
        &lt;li&gt;SMIC - N+2 7nm&lt;/li&gt;
        &lt;li&gt;YMTC - 232L NAND&lt;/li&gt;
        &lt;li&gt;CXMT - 22nm DRAM&lt;/li&gt;
        &lt;li&gt;Winbond - 25nm Pseudo-Static RAM&lt;/li&gt;        
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